- Hand mounting of complex hybrid devices with attention to tight tolerance placement of critical components.
- Hot gas die attach.
- Wire bonding: Ribbon bonding, Wire bonding, and Ball bonding.
- Package sealing: Solder sealing and Seam Sealing.
- Leak Testing
- Inspect incoming materials to specifications; conduct visual and measurement testing.
- Following procedures for processing acceptable and reject materials.
- Inspect in-process production by conducting visual and measurement tests against specifications.
- Minimum education of High School Diploma or GED
- 10+ years of microelectronic manufacturing environment preferred
- Must have working knowledge of Military Specifications